文献
J-GLOBAL ID:201702238610709522
整理番号:17A0214145
統合FEM応用のための可変シリコン厚さ300mm鋳造HRSOI技術【Powered by NICT】
A 300mm foundry HRSOI technology with variable silicon thickness for integrated FEM applications
著者 (12件):
Toh Rui Tze
(GLOBALFOUNDRIES, 60 Woodlands Industrial Park-D, Street-2, Singapore-738406)
,
Parthasarathy Shyam
(GLOBALFOUNDRIES, 60 Woodlands Industrial Park-D, Street-2, Singapore-738406)
,
Sun Tao
(GLOBALFOUNDRIES, 60 Woodlands Industrial Park-D, Street-2, Singapore-738406)
,
Zhang Shaoqiang
(GLOBALFOUNDRIES, 60 Woodlands Industrial Park-D, Street-2, Singapore-738406)
,
Purakh Raj Verma
(GLOBALFOUNDRIES, 60 Woodlands Industrial Park-D, Street-2, Singapore-738406)
,
Zhu Chao Song
(GLOBALFOUNDRIES, 60 Woodlands Industrial Park-D, Street-2, Singapore-738406)
,
Nune Venkata Sudheer
(GLOBALFOUNDRIES, 60 Woodlands Industrial Park-D, Street-2, Singapore-738406)
,
Wong Jen Shuang
(GLOBALFOUNDRIES, 60 Woodlands Industrial Park-D, Street-2, Singapore-738406)
,
Govindarajan Madabusi
(GLOBALFOUNDRIES Engineering Private Limited, 9th Floor, Manyata Embassy Business Park, Bangalore, India - 560045)
,
Yoo Yong Koo
(GLOBALFOUNDRIES, 60 Woodlands Industrial Park-D, Street-2, Singapore-738406)
,
Chew Kok Wai
(GLOBALFOUNDRIES, 60 Woodlands Industrial Park-D, Street-2, Singapore-738406)
,
Ang Diing Shenp
(School of EEE, Nanyang Technological University, Nanyang Avenue, Singapore 639798)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2016
号:
IEDM
ページ:
2.4.1-2.4.4
発行年:
2016年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)