Research field (1):
Inorganic and coordination chemistry
Research keywords (4):
電気化学
, WWW
, Electrochemistry
, WWW
Research theme for competitive and other funds (4):
2002 - 2004 ウェットプロセスによるCu拡散防止膜の開発
2002 - 2004 Development of diffusion barrier by electro chemical deposition
2002 - 2003 高速駆動プリント配線板Cuめっきに関する研究
2002 - 2003 Reserch on the Cupper Plating for the Printed Circuit Board
MISC (5):
Electroless-Deposited Co-W-P Films for Chip Electrodes of Three Dimensional Packaging. The Seventh VLSI Packaging Workshop of Japan Technical Digest, IEEE. 2004. pp. 101- 104
Electroless-Deposited Co-W-P Films for Chip Electrodes of Three Dimensional Packaging. The Seventh VLSI Packaging Workshop of Japan Technical Digest, IEEE. 2004. pp. 101- 104
表面技術
, エレクトロニクス実装学会
, 応用物理学会
, Journal of The Surface Finishing Society of Japan
, Journal of Japan Institute of Electronics Packaging
, The Japan Society of Applied Physics