Rchr
J-GLOBAL ID：200901022148189740
Update date: Sep. 04, 2022
Hagiwara Shinsaku
ハギワラ シンサク | Hagiwara Shinsaku
Contact this researcher
You can send email directly to the researcher.
Research field (1)：
Manufacturing and production engineering
Research keywords (12)：
Production machine
, grinding
, Cutting
, Machine process
, 生産加工機械
, 研削加工
, 切削加工
, 機械加工
, 生産工学・加工学
, Palishing
, Cutting
, Grinding
Research theme for competitive and other funds (8)：
Proposal for Die Polishing Using a New Bonding Abrasive Type Grinduing Stone
シリコンウエハの研磨
高速流動研磨
ダイヤモンド砥粒の破砕性評価
MAGIC砥石の開発とその応用
金型研磨用砥石の開発
石材加工におけるダイヤモンド砥粒の破砕性
Edge Fracture Characteristics of Diamond Grains in Grinding Processes
Show all
MISC (32)：
HAGIWARA Shinsaku, MURAKAMI Joji, SANO Teruo, OBIKAWA Toshiyuki. Basic Research on the Evaluation of Tip Edge on Diamond Grain : Dependence of Edge Shape on the Glass Crack at Cutting. Journal of the Japan Society for Precision Engineering. Supplement. Contributed papers. 2005. 71. 5. 618-622
S Hagiwara, N Kawashima, N Umehara, Shibata, I. Proposal for die polishing using a new bonding abrasive type grinding stone: Development of MAGIC grinding stone. MACHINING SCIENCE AND TECHNOLOGY. 2003. 7. 2. 267-279
S Hagiwara, N Kawashima, N Umehara, Shibata, I. Proposal for die polishing using a new bonding abrasive type grinding stone: Development of MAGIC grinding stone. MACHINING SCIENCE AND TECHNOLOGY. 2003. 7. 2. 267-279
S Hagiwara, T Obikawa. Evaluation of edge fracture characteristics of diamond grains in stone grinding processes. MACHINING SCIENCE AND TECHNOLOGY. 2002. 6. 1. 53-66
Shinsaku Hagiwara, Toshiyuki Obikawa. Evaluation of edge fracture characteristics of diamond grains in stone grinding processes. Machining Science and Technology. 2002. 6. 1. 53-66
ｍore...
Patents (2)：
砥石の製造方法、砥石及び研磨方法
研磨運動装置
Lectures and oral presentations (5)：
シリコンウエハの研磨に関する研究
(山梨講演会講演論文集 2007)
フラクタル次元による工具摩耗の評価
(山梨講演会講演論文集 2007)
弾性砥石による金型研磨
(日本機械学会論文集 2007)
ナノ加工実現のための砥粒切れ刃形状とは
(2007)
3-DPolishing using MAGIC polishing Tool
(IICMM2002 2002)
Works (3)：
Minimum Damage on Silicone Wafer by MAGIC Wheel and Development of Polishing Machine
2003 -
Die Polishing by the Magnetic Fluid
2000 -
Ultra-thinning of the Crystal Resonator
Professional career (2)：
(BLANK)
(BLANK)
Work history (1)：
University of Yamanashi Department of Research Interdisciplinary Graduate School of Medicine and Engineering, Information System Engineering
Association Membership(s) (3)：
日本機械学会
, 砥粒加工学会
, 精密工学会
※ Researcher’s information displayed in J-GLOBAL is based on the information registered in
researchmap
.
For details, see here
.
Return to Previous Page
TOP
BOTTOM
