Kurashima Yuichi

クラシマユウイチ | Kurashima Yuichi

Research field (2)： Manufacturing and production engineering , Thin-film surfaces and interfaces

Research keywords (11)：常温接合 , 気密封止 , 低温接合 , イオンビーム , 精密加工 , 研磨 , 研削 , ナノインプリント , 微細加工 , 薄膜・表面界面物性 , ultraprecision machining

Research theme for competitive and other funds (3)：

2022 - 2025 Construction of a dynamic evacuation guidance system based on intelligent and distributed cooperative processing of evacuation guidance devices and disaster prevention sensors
2019 - 2022 Research about ultra-high hermetic seal bonding for microcavity by quantum sensing
2016 - 2019 Room temperature metal bonding for highly hermetic sealing of microdevice

Papers (86)：

Takashi Matsumae, Hitoshi Umezawa, Yuichi Kurashima, Hideki Takagi. (Invited, Digital Presentation) Low-Temperature Direct Bonding of Wide-Bandgap Semiconductor Substrates. ECS Transactions. 2023
Shingo Kariya, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Masanori Hayase, Eiji Higurashi. Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging. Microsystems & Nanoengineering. 2022. 8. 1
Takashi Matsumae, Shingo Kariya, Yuichi Kurashima, Le Hac Huong Thu, Eiji Higurashi, Masanori Hayase, Hideki Takagi. Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging. Sensors. 2022. 22. 21
Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Yusuke Shirayanagi, Shuichi Hiza, Kunihiko Nishimura, Eiji Higurashi. Room temperature bonding of GaN and diamond substrates via atomic layer. Scripta Materialia. 2022. 215
Shoya Fukumoto, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Masanori Hayase, Eiji Higurashi. Hydrophilic direct bonding of GaN and Si substrates by wet treatments using H2SO4/H2O2mixture and NH3/H2O2mixture. Japanese Journal of Applied Physics. 2022. 61. SF

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MISC (12)：

松前貴司, 倉島優一, 高木秀樹, 西薗和則, 天野力, 日暮栄治. AlNセラミック放熱基板とSi半導体基板の常温直接接合. エレクトロニクス実装学会講演大会講演論文集(CD-ROM). 2021. 35th
Room-temperature wafer bonding using Ti thin films : Introduction of capping layer and nano silicon layer. 「センサ・マイクロマシンと応用システム」シンポジウム論文集電気学会センサ・マイクロマシン部門 [編]. 2019. 36. 4p
山本道貴, 山本道貴, 松前貴司, 倉島優一, 高木秀樹, 須賀唯知, 伊藤寿浩, 日暮栄治, 日暮栄治. Investigation about plasma conditions for room-temperature wafer-scale Au-Au bonding using ultrathin Au films in ambient air. センサ・マイクロマシンと応用システムシンポジウム(CD-ROM). 2018. 35th
Takagi, Hideki, Kurashima, Yuichi, IEEE. Surface Activated Room-temperature Bonding in Ar Gas Ambience for MEMS Encapsulation. 2017 5th International Workshop on Low Temperature Bonding For 3d Integration (Ltb-3d). 2017. 46-46
Kurashima, Y., Maeda, A., Takagi, H., IEEE. Direct transfer of atomically smooth Au film onto electroplated patterns for room-temperature Au-Au bonding in atmospheric air. 2017 5th International Workshop on Low Temperature Bonding For 3d Integration (Ltb-3d). 2017. 56-56

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Professional career (1)：

Work history (4)：

2022 - 現在 National Institute of Advanced Industrial Science and Technology Group Leader
2012/04 - 2021/03 国立研究開発法人産業技術総合研究所集積化マイクロシステム研究センター主任研究員
2015 - LETI
2008/04 - 2012/03 国立大学法人山梨大学工学部機械システム工学科助教

Committee career (3)：

Association Membership(s) (3)：

精密工学会 , 応用物理学会 , エレクトロニクス実装学会

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