Research theme for competitive and other funds (25)：
2020 - 2023 ビッグデータからの材料特性の高速モデル学習と最適化
2016 - 2018 Structural material joining utilizing stress migration
2012 - 2017 Science of Hetero-Interface of Advanced Power Devises in Extreme Environments
2009 - 2013 Tin whisker growth mechanism in aerospace electronics and its mitigation
2011 - 2012 Room temperature and ambient condition joint materials fabrication with metal nano-inks
2008 - 2011 Development of Artificial Tactile Communication system for Tangible Android
2010 - 2010 プリンテッド・エレクトロニクス技術を用いたバイオナノファイバー基板の開発
2010 - 2010 電子デバイス実装技術におけるセルロースナノファイバー補強導電性接着剤の開発
2005 - 2008 Synthesis of mono-dispersed metallic nanoparticles and its application to electronics wiring
2004 - 2005 微細回路パターン用金属ナノ粒子ペーストの開発及び焼結過程解析
2001 - 2003 PREVENTION OF FORMATION OF SOLIDIFICATION DEFECTS LOR LEAD-FREE SOLDERING
2001 - 2002 Nanostructure Determination and Properties of New Atomic Harmonized Materials
1999 - 2000 Direct Atomic Structure-Analysis and Properties of New Nano- and Solid-Clusters
1998 - 1998 多孔質セラミックスのマシナブル化によるセラミックス複合体ニアネット製造
1997 - 1998 Improvement of mechanical properties of short fiber reinforced
1996 - 1997 A Research on Multi-functional Ceramic Based Nanocomposites
1996 - 1996 高次機能調和材料の設計・創成と評価
1986 - 1987 Production of rapidly solidified Fe-C-Si bulk materials by plasma-spraying and their characterization
1983 - 1983 超高圧力を利用したセラミックスと金属の接合
プリンテッドエレクトロニクス
鉛フリー実装技術に関する研究
異種材料接合に関する研究
Printed Electronics
Lead-free electronics soldering
Joining of Dissimilar Materials
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Papers (726)：
Shuaijie Zhao, Chuantong Chen, Masahiko Nishijima, Rieko Okumura, Motoharu Haga, Minoru Ueshima, Hirose Suzuki, Hiroto Takenaka, Katsuaki Suganuma. Effects of high temperature and high humidity on the reliability of copper/epoxy bond. Applied Surface Science. 2024. 660. 159970-159970
Fupeng Huo, Chuantong Chen, Zheng Zhang, Ye Wang, Aiji Suetake, Kazutaka Takeshita, Yoshiji Yamaguchi, Yashima Momose, Katsuaki Suganuma. Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging. Materials & Design. 2024. 240. 112863-112863
Shuaijie Zhao, Chuantong Chen, Masahiko Nishijima, Motoharu Haga, Minoru Ueshima, Hirose Suzuki, Hiroto Takenaka, Katsuaki Suganuma. Copper diffusion into epoxy under high temperature. Materials Letters. 2024. 361. 136157-136157
Dongjin Kim, Seungyeop Baek, Masahiko Nishijima, Hyun-chul Lee, Peihao Geng, Ninshu Ma, Zheng Zhang, Hyunsu Park, Chuantong Chen, Seung-Joon Lee, et al. Toward defect-less and minimized work-hardening loss implementation of Al alloy/high-purity Cu dissimilar lap joints by refill friction stir spot welding for battery tab-to-busbar applications. Materials Science and Engineering: A. 2024. 146089-146089
Dongjin Kim, Chuantong Chen, Sangmin Lee, Min-Su Kim, Katsuaki Suganuma. Controlling the thermal aging and Kirkendall void diffusion speed of sputtered silver interlayers in GaN power semiconductor packaging interfaces for in-wheel motor system integrations. Corrosion Science. 2024. 226. 111614-111614
ZHANG Zheng, 末武愛士, LIU Ran, 西嶋雅彦, 奥村理恵子, 加賀美紀子, CHEN Chuantong, 瀬戸寛生, 橋爪佳, 長谷川典彦, et al. Low-pressure 20 μm Copper Micro-bump Bonding through Silver Metallization Layer for Advanced Packaging. マイクロエレクトロニクスシンポジウム論文集. 2023. 33rd
菅沼克昭, HSIEH Ming-chun, ZHANG Zheng, 西嶋雅彦, 末武愛司, CHEN Chuantong, LI Wangyun, 吉田浩芳. Reliability of Advanced Semiconductor Substrates and Their Evaluation Methods. Symposium on Microjoining and Assembly Technology in Electronics. 2023. 29th
HSIEH Ming-chun, ZHANG Zheng, NISHIJIMA Masahiko, YEON Jeyun, SUETAKE Aiji, CHEN Chenchuantong, YOSHIDA Hiroyoshi, KAN Toshiyuki, HONNMA Hidekazu, MATSUNAMI Takushi, et al. Microstructural Characterization of Weak Micro-Via by Electron Microscopy. マイクロエレクトロニクスシンポジウム論文集. 2022. 32nd
Sinter Joining Technology for WBG
(21th International Symposium on Eco-Materials Processing and Design 2020)
Ceramics to metal joining for next generation power devices
(Advanced Ceramics and application VIII; New Frontiers in Multifunctional Material Science and Processing 2019)
Nanomaterials Development at ISIR for IoT Sensing Devices and their Applications
(2019 IEEE 9th International Conference on Nanomaterials: Applications & Properties 2019)
Printed wiring and transparent electrode technology for flexible display
(International Symposium on Advanced Display Materials and Devices 2019)
Ceramics to metal joining for next generation power devices
(43rd International Conference and Exposition on Advanced Ceramics and Composites 2019)
