Research field (4)：
Composite materials and interfaces
, Material fabrication and microstructure control
, Electronic devices and equipment
, Manufacturing and production engineering
Research keywords (6)：
エレクトロニクス実装
, 微細接合
, はんだ付
, 界面反応
, Nano-& Micro-joining
, Green electronics
Research theme for competitive and other funds (8)：
2019 - 2022 Low-temperature bonding using nanostructure on material surface
2016 - 2019 Bonding process for sintered layer with high thermostability using a nanoporous structure
2013 - 2016 Microjoining technology using sintering process of 3D nanoporous structure
2011 - 2013 フレキシブルデバイス向け高信頼性Cu粒子含有導電性接着剤の開発
2010 - 2012 Effect of miniaturization of solder joint for electronics packagingon interfacial reaction between solder and substrate and impact reliability of the joint
2005 - 2006 酸素吹き込みによる微生物活性化のバイオリーチングへの適用性
2004 - 2006 Analysis of arc-cathode system from in-situ diagnostics of tungsten electrode during operation
2004 - 2005 レーザを利用したアルミニウム合金スクラップの固相分別技術に関する研究
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Papers (471)：
Chuncheng Wang, Hiroaki Tatsumi, Liang Xu, Tao Zhao, Pengli Zhu, Rong Sun, Hiroshi Nishikawa. Transparent Liquid Ag-Based Complex for the Facile Preparation of Robust Sintered Ag Joints in Power Devices. ACS Applied Electronic Materials. 2024. 6. 1718-1728
Jianhao Wang, Shogo Yodo, Hiroaki Tatsumi, Hiroshi Nishikawa. Bonding strength of ENIG joint using micro-sized Ag particles with submicron ceramic particles. TMS2024 Annual Meeting & Exhibition,. 2024
Shunya Nitta, Hiroaki Tatsumi, Hiroshi Nishikawa. Tensile strength of Sn-In Eutectic Solder with Surface Modified ZrO2 Nanoparticles. The Advanced Materials Research Grand Meeting (MRM2023/IUMRS-ICA2023), Kyoto, Japan. 2023
Hiroaki Tatsumi, Hiroshi Nishikawa. Enhanced Thermal Conductivity in Micro Composite Structure Joints Utilizing Porous Cu Sheets. The 5th International Conference on Nanojoining and Microjoining (NMJ 2023), Leipzig, Germany. 2023
Takahiro Kozawa, Hiroaki Tatsumi, Hiroshi Nishikawa. Synthesis of macroporous microspheres through a thermal decomposition in water vapor and its application to nanoparticle collection. The 3rd International Symposium on Design & Engineering by Joint Inverse Innovation for Materials Architecture (DEJI2MA-3), Tokyo. 2023
Potential of low temperature soldering using hypoeutectic Sn-Bi alloys
(7th International Conference on Advanced Electromaterials 2023)
Solid-phase bonding process using nanostructured surface for power devices in automotive
(17th International Conference Reliability and Stress-Related Phenomena in Nanoelectornics (IRSP 2023) 2023)
Solid-phase bonding using nanostructured surface for power devices
(Seminar between IMS-VAST and JWRI-OU 2023)
Die bonding process using nanostructured surface for power devices
(International Welding/Joining Conference-Korea 2022 2022)
Thermal Conductivity of Sintered Joint Using Micro-sized Ag Particles for Power Devices
(2021 Materials Research Society-Taiwan International Conference (2021 MRSTIC) 2021)
2018/05 - IEEE Electronics Packaging Society 67th ECTC Best Interactive Session Paper
2017/08 - Chinese Institute of Electronics, China Best Student Paper Award, 3rd Place
2015/09 - (一社)エレクトロニクス実装学会 MES2014ベストペーパー賞
2015/07 - Osaka University Osaka University Presidential Awards for Encouragement
2014/07 - 大阪大学 大阪大学総長奨励賞
2013/10 - EMAP/ISMP 2013 Outstanding Poster Paper Award
2013/06 - The International Electrotechnical Commission IEC 1906 Award
2012/11 - The 3rd International Symposium on Advanced Materials Development and Integration of Novel Structural Metallic and Inorganic Materials (AMDI-3) Best Poster Presentation
2009/05 - (社)軽金属溶接構造協会 第27回軽金属溶接論文賞
2007/05 - Korean Welding and Joining Society Best Poster Award, IWJC-Korea 2007
2007/04 - (社)溶接学会 研究発表賞
2006/03 - (社)エレクトロニクス実装学会 研究奨励賞
2005/01 - (社)軽金属学会関西支部 研究発表優秀賞
2005/01 - soldertec global Lead-free Solder Award 2004
