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ArticleJ-GLOBAL ID:200902000048950541整理番号:84A0063641

An appraisal of high temperature humidity stress tests for assessing plastic encapsulated semiconductor components.

プラスチックカプセル封じの半導体素子評価のための高温・高湿・ストレステストの評価

著者:MERRETT R P(British Telecom)、BRYANT J P(British Telecom)、STUDD R(British Telecom)
資料名:Annu Proc Int Reliab Phys Symp 巻:21st ページ:73-82
発行年:1983年
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J-GLOBAL: Linking, Expanding and Sparking

About J-GLOBAL

Linking

J-GLOBAL links information that represents the key to research and development. For example, linking articles and patents with people (authors and inventors) enables the extraction of a sequence of information.
It’s useful for making new discoveries and uncovering new information.

Expanding

The system enables searches of similar kinds of content through linkage with external sites.
It helps you to obtain knowledge from dissimilar fields and discover concepts that cross the boundaries of specialisms.

Sparking

Through repeated linkage and expansioniteration, J-GLOBAL provides unexpected hints for problem-solving and the illumination of new ideas.