Art
J-GLOBAL ID：200902000096238543   Reference number：93A0026514

Fatal electromigration voids in narrow aluminum-copper interconnect.

狭いアルミニウム-銅相互接続での致命的なエレクトロマイグレーションボイド
Author (1)：
ROSE J H

About ROSE J H

(Digital Equipment Corp., Massachusetts)

About Digital Equipment Corp., Massachusetts


Material：
Applied Physics Letters  (Appl Phys Lett)

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Volume： 61  Issue： 18  Page： 2170-2172  Publication year： Nov. 02, 1992 
JST Material Number： H0613A  ISSN： 0003-6951  CODEN： APPLAB  Document type： Article
Article type： 短報  Country of issue： United States (USA)  Language： ENGLISH (EN)
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aluminum base alloy

About aluminum base alloy

,...
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JST classification (3)：
JST classification
Category name(code) classified by JST.
Lattice defects in metals 
(BK12030F)

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,  Diffusion in metals 
(BL06022C)

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,  Manufacturing technology of solid-state devices 
(NC03030V)

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Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
アルミニウム

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, 
銅

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, 
相互接続

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