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Articleの詳細情報

ArticleJ-GLOBAL ID:200902000114016707整理番号:89A0019836

Using metallic coatings to enhance themal contact conductance of electronic packages.

電子部品パッケージの熱接触抵抗を改善する金属被覆の利用

著者:ANTONETTI V W(International Business Machines Corp., NY, USA)、YOVANOVICH M M(Univ. Waterloo, CAN)
資料名:Heat Trans Eng 巻:9 号:3 ページ:85-92
発行年:1988年
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J-GLOBAL: Linking, Expanding and Sparking

About J-GLOBAL

Linking

J-GLOBAL links information that represents the key to research and development. For example, linking articles and patents with people (authors and inventors) enables the extraction of a sequence of information.
It’s useful for making new discoveries and uncovering new information.

Expanding

The system enables searches of similar kinds of content through linkage with external sites.
It helps you to obtain knowledge from dissimilar fields and discover concepts that cross the boundaries of specialisms.

Sparking

Through repeated linkage and expansioniteration, J-GLOBAL provides unexpected hints for problem-solving and the illumination of new ideas.