Art
J-GLOBAL ID：200902001854853374   Reference number：89A0505631

New polyimides for high density interconnect packaging.

高密度配線接続パッケジング用新ポリイミド
Author (2)：
CRAIG J D

About CRAIG J D

(E.I. du Pont de Nemours & Co., Inc., DE, USA)

About E.I. du Pont de Nemours & Co., Inc., DE, USA

, 
LAUTENBERGER W J

About LAUTENBERGER W J

(E.I. du Pont de Nemours & Co., Inc., DE, USA)

About E.I. du Pont de Nemours & Co., Inc., DE, USA


Material：
Proceedings of the Technical Program. National Electronic Packaging and Production Conference  (Proc Tech Program Natl Electron Packag Prod Conf)

About Proceedings of the Technical Program. National Electronic Packaging and Production Conference


Volume： 1989  Issue： West Vol.1  Page： 925-926  Publication year： 1989 
JST Material Number： H0116B  Document type： Proceedings
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
high density packaging

About high density packaging

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
チップ【IC】

About チップ【IC】


   To see more with JDream III (charged).   {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=89A0505631&from=J-GLOBAL&jstjournalNo=H0116B") }}
JST classification (2)：
JST classification
Category name(code) classified by JST.
Materials of solid-state devices 
(NC03020K)

About Materials of solid-state devices

,  Physical properties in general 
(YH02021U)

About Physical properties in general

Terms in the title (1)：
Terms in the title
Keywords automatically extracted from the title.
ポリイミド

About ポリイミド


Return to Previous Page

TOP

BOTTOM