Art
J-GLOBAL ID：200902001905787827   Reference number：81A0412700

Decapsulation of silicone potted electronic assemblies.

Siでポットした電子部品の外装除去法
Author (2)：
DUBEY G C

About DUBEY G C

(Solid-State Physics Lab., India)

About Solid-State Physics Lab., India

, 
PADMANABHAN K V

About PADMANABHAN K V

(Solid-State Physics Lab., India)

About Solid-State Physics Lab., India


Material：
Journal of the Institution of Electronics and Telecommunication Engineers  (J Inst Electron Telecommun Eng)

About Journal of the Institution of Electronics and Telecommunication Engineers


Volume： 27  Issue： 1  Page： 21-23  Publication year： Jan. 1981 
JST Material Number： C0312A  ISSN： 0377-2063  Document type： Article
Article type： 解説  Country of issue： India (IND)  Language： ENGLISH (EN)
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All keywords is available on JDreamIII(charged).
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encapsulation

About encapsulation

,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Measurement,testing and reliability of solid-state devices 
(NC03040G)

About Measurement,testing and reliability of solid-state devices

Terms in the title (5)：
Terms in the title
Keywords automatically extracted from the title.
Si

About Si

, 
ポット

About ポット

, 
電子部品

About 電子部品

, 
外装

About 外装

, 
除去法

About 除去法


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