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J-GLOBAL ID：200902001978962821   Reference number：89A0403816

Room temperature staging of epoxy/anhydride resin formulations.

エポキシ/無水化合物樹脂組成の室温ステージング
Author (2)：
ZUKAS W X

About ZUKAS W X

(U.S. Army Materials Technology Lab., MA, USA)

About U.S. Army Materials Technology Lab., MA, USA

, 
GHIORSE S R

About GHIORSE S R

(U.S. Army Materials Technology Lab., MA, USA)

About U.S. Army Materials Technology Lab., MA, USA


Material：
Society of Plastics Engineers. Annual Technical Conference  (Society of Plastics Engineers. Technical Papers)

About Society of Plastics Engineers. Annual Technical Conference


Volume： 47th  Page： 1083-1085  Publication year： 1989 
JST Material Number： H0492A  Document type： Proceedings
Article type： 解説  Country of issue： United States (USA)  Language： ENGLISH (EN)
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epoxy resin

About epoxy resin

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
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bridging agent

About bridging agent

,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Epoxy resins 
(YH07040I)

About Epoxy resins

Terms in the title (2)：
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組成

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, 
室温

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