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ArticleJ-GLOBAL ID:200902001986243524整理番号:91A0819883

HIP-diffusion bonding of ODS-materials by use of plasma sprayed encapsulation.

プラズマ溶射カプセル封じを用いたODS材料のHIP拡散溶接

著者:HAMMELMANN K H(Forschungszentrum GmbH Juelich, DEU)、BUCHKREMER H P(Forschungszentrum GmbH Juelich, DEU)、STOEVER D(Forschungszentrum GmbH Juelich, DEU)
資料名:Diffus Bond 2 ページ:250-260
発行年:1991年
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