About J-GLOBAL

日本語

Font size
  • A
  • A

Articleの詳細情報

ArticleJ-GLOBAL ID:200902002018622020整理番号:91A0877896

ホットエアーによるリフローハンダ付けの信頼性

Reliability of reflow soldering by hot air.

著者:小島康(富士通)、菊池美佐男(富士通)、松永勝樹(富士通)・・・
資料名:ジョイテック 巻:7 号:8 ページ:109-114
発行年:1991年08月
  • J-GLOBAL home
  • Bookmark J-GLOBAL

J-GLOBAL: Linking, Expanding and Sparking

About J-GLOBAL

Linking

J-GLOBAL links information that represents the key to research and development. For example, linking articles and patents with people (authors and inventors) enables the extraction of a sequence of information.
It’s useful for making new discoveries and uncovering new information.

Expanding

The system enables searches of similar kinds of content through linkage with external sites.
It helps you to obtain knowledge from dissimilar fields and discover concepts that cross the boundaries of specialisms.

Sparking

Through repeated linkage and expansioniteration, J-GLOBAL provides unexpected hints for problem-solving and the illumination of new ideas.