Art
J-GLOBAL ID:200902002018622020   Reference number:91A0877896

Reliability of reflow soldering by hot air.

ホットエアーによるリフローハンダ付けの信頼性
Author (4):
Material:
Volume:Issue:Page: 109-114  Publication year: Aug. 1991 
JST Material Number: Y0887A  ISSN: 0916-1597  Document type: Article
Article type: 解説  Country of issue: Japan (JPN)  Language: JAPANESE (JA)
Thesaurus term:
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
,...
Semi thesaurus term:
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.

   To see more with JDream III (charged).   {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=91A0877896&from=J-GLOBAL&jstjournalNo=Y0887A") }}
JST classification (2):
JST classification
Category name(code) classified by JST.
Manufacturing technology of solid-state devices  ,  Brazing 
Terms in the title (2):
Terms in the title
Keywords automatically extracted from the title.

Return to Previous Page