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ArticleJ-GLOBAL ID:200902002073201165整理番号:90A0064734

Thermal characterization of chip-on-board packaging mechanisms.

ボード搭載チップのパッケージ機構の熱特性化評価

著者:ESTES R C(Bellcore, New Jersey)
資料名:ASME HTD (Am Soc Mech Eng Heat Transf Div) 巻:111 ページ:183-190
発行年:1989年
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About J-GLOBAL

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J-GLOBAL links information that represents the key to research and development. For example, linking articles and patents with people (authors and inventors) enables the extraction of a sequence of information.
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Expanding

The system enables searches of similar kinds of content through linkage with external sites.
It helps you to obtain knowledge from dissimilar fields and discover concepts that cross the boundaries of specialisms.

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