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ArticleJ-GLOBAL ID:200902002092660260整理番号:91A0395097

マイクロリレーはんだ付けに関する一考察

Study of high quality soldering technology for micro relay.

著者:小川善三(日立 戸塚工場)、安部勲(日立 戸塚工場)、坂井和隆(日立 戸塚工場)
資料名:電子情報通信学会全国大会講演論文集 巻:1991 号:Spring Pt 5 ページ:5.314
発行年:1991年03月
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J-GLOBAL: Linking, Expanding and Sparking

About J-GLOBAL

Linking

J-GLOBAL links information that represents the key to research and development. For example, linking articles and patents with people (authors and inventors) enables the extraction of a sequence of information.
It’s useful for making new discoveries and uncovering new information.

Expanding

The system enables searches of similar kinds of content through linkage with external sites.
It helps you to obtain knowledge from dissimilar fields and discover concepts that cross the boundaries of specialisms.

Sparking

Through repeated linkage and expansioniteration, J-GLOBAL provides unexpected hints for problem-solving and the illumination of new ideas.