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ArticleJ-GLOBAL ID:200902015490227759整理番号:90A0758697

3D interconnection for ultra-dense multichip modules.

超高密度多チップモジュールのための3D相互接続

著者:VAL C(Thomson‐CSF DCS Computer Division, Colombes, FRA)、LEMOINE T(Thomson‐CSF RCM Radar Countermeasures Division, Malakoff, FRA)
資料名:Proc Electron Compon Technol Conf 巻:40th 号:Vol 1 ページ:540-547
発行年:1990年
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J-GLOBAL: Linking, Expanding and Sparking

About J-GLOBAL

Linking

J-GLOBAL links information that represents the key to research and development. For example, linking articles and patents with people (authors and inventors) enables the extraction of a sequence of information.
It’s useful for making new discoveries and uncovering new information.

Expanding

The system enables searches of similar kinds of content through linkage with external sites.
It helps you to obtain knowledge from dissimilar fields and discover concepts that cross the boundaries of specialisms.

Sparking

Through repeated linkage and expansioniteration, J-GLOBAL provides unexpected hints for problem-solving and the illumination of new ideas.