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Articleの詳細情報

ArticleJ-GLOBAL ID:200902015504857475整理番号:91A0567936

Rheology and printability of solder paste.

著者:OGATA S(OKI Electric Industry Co., Ltd., Gumma, JPN)、KANAZAWA J(OKI Electric Industry Co., Ltd., Gumma, JPN)
資料名:Proc 6th Int Microelectron Conf 1990 ページ:109-114
発行年:1990年
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J-GLOBAL: Linking, Expanding and Sparking

About J-GLOBAL

Linking

J-GLOBAL links information that represents the key to research and development. For example, linking articles and patents with people (authors and inventors) enables the extraction of a sequence of information.
It’s useful for making new discoveries and uncovering new information.

Expanding

The system enables searches of similar kinds of content through linkage with external sites.
It helps you to obtain knowledge from dissimilar fields and discover concepts that cross the boundaries of specialisms.

Sparking

Through repeated linkage and expansioniteration, J-GLOBAL provides unexpected hints for problem-solving and the illumination of new ideas.