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ArticleJ-GLOBAL ID:200902015534026128整理番号:94A0461783

粘弾性を考慮した構造解析シミュレーションによる半導体用パッケージ材料の性能評価

Performance evaluation of package materials for a semiconductor by a structual analysis simulation considering viscoelasticity.

著者:奥間啓二(松下電子工業 京都研)、佐竹哲朗(松下電子工業 京都研)、若林たかし(松下電子工業 京都研)
資料名:ポリマー材料フォーラム講演要旨集 巻:1st ページ:161-162
発行年:1992年12月
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About J-GLOBAL

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