About J-GLOBAL

日本語

Font size
  • A
  • A

Articleの詳細情報

ArticleJ-GLOBAL ID:200902015649800420整理番号:86A0457689

Effects of temperature and moisture on module leakage currents.

モジュール漏れ電流におよぼす温度と湿度の作用

著者:MON G(California Inst. Technology)、WEN L(California Inst. Technology)、ROSS R G JR(California Inst. Technology)・・・
資料名:Conf Rec IEEE Photovoltaic Spec Conf 巻:18th ページ:1179-1185
発行年:1985年
  • J-GLOBAL home
  • Bookmark J-GLOBAL

J-GLOBAL: Linking, Expanding and Sparking

About J-GLOBAL

Linking

J-GLOBAL links information that represents the key to research and development. For example, linking articles and patents with people (authors and inventors) enables the extraction of a sequence of information.
It’s useful for making new discoveries and uncovering new information.

Expanding

The system enables searches of similar kinds of content through linkage with external sites.
It helps you to obtain knowledge from dissimilar fields and discover concepts that cross the boundaries of specialisms.

Sparking

Through repeated linkage and expansioniteration, J-GLOBAL provides unexpected hints for problem-solving and the illumination of new ideas.