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ArticleJ-GLOBAL ID:200902015677670389整理番号:92A0155719

微小・高密度実装技術 多ピンQFPのソルダリング技術 パソコン実装において

Minute, high-density packaging technology.Soldering technology of multipin QFP.In personal computer mounting.

著者:内田将巳(セイコーエプソン)
資料名:月刊Semiconductor World 巻:11 号:2 ページ:111-116
発行年:1992年01月
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J-GLOBAL: Linking, Expanding and Sparking

About J-GLOBAL

Linking

J-GLOBAL links information that represents the key to research and development. For example, linking articles and patents with people (authors and inventors) enables the extraction of a sequence of information.
It’s useful for making new discoveries and uncovering new information.

Expanding

The system enables searches of similar kinds of content through linkage with external sites.
It helps you to obtain knowledge from dissimilar fields and discover concepts that cross the boundaries of specialisms.

Sparking

Through repeated linkage and expansioniteration, J-GLOBAL provides unexpected hints for problem-solving and the illumination of new ideas.