Art
J-GLOBAL ID：200902015677670389   Reference number：92A0155719

Minute, high-density packaging technology.Soldering technology of multipin QFP.In personal computer mounting.

微小・高密度実装技術 多ピンQFPのソルダリング技術 パソコン実装において
Author (1)：
UCHIDA MASAMI

About UCHIDA MASAMI

(セイコーエプソン)

About セイコーエプソン


Material：
月刊Semiconductor World  (月刊セミコンダクターワールド)

About 月刊Semiconductor World


Volume： 11  Issue： 2  Page： 111-116  Publication year： Jan. 1992 
JST Material Number： Y0509A  ISSN： 0286-5025  Document type： Article
Article type： 解説  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
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personal computer

About personal computer

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
STM

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,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Printed circuits 
(NA05040O)

About Printed circuits

Terms in the title (6)：
Terms in the title
Keywords automatically extracted from the title.
微小

About 微小

, 
高密度実装

About 高密度実装

, 
QFP

About QFP

, 
ソルダリング

About ソルダリング

, 
パソコン

About パソコン

, 
実装

About 実装


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