Re-entrant cavity surface enhancements for immersion cooling of silicon multichip packages.

PHADKE N K; BHAVNANI S H; GOYAL A; JAEGER R C; GOODLING J S

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J-GLOBAL ID：200902015709074350 Reference number：92A0420794

Re-entrant cavity surface enhancements for immersion cooling of silicon multichip packages.

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Author (5)： , , , ,
Material：
Page： 59-65 Publication year： 1992
JST Material Number： K19920133 ISBN： 0-7803-0504-3 Document type： Proceedings
Country of issue： United States (USA) Language： ENGLISH (EN)

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