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J-GLOBAL ID:200902023273346807   Reference number:87A0311668

Development of the instant liquid phase bonding process (ILP bonding process). 1. Application to different metal welding.

瞬間液相接合法(ILP接合法)の開発 I 異材接合への適用
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Material:
Issue: 40  Page: 142-143  Publication year: Mar. 15, 1987 
JST Material Number: F0641A  Document type: Proceedings
Article type: 短報  Country of issue: Japan (JPN)  Language: JAPANESE (JA)
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Welding techniques 
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