Art
J-GLOBAL ID：200902051376233664   Reference number：83A0086697

Mold temperature profiles in epoxy resin casting process development.

エポキシ樹脂の注型工程における金型の温度分布
Author (1)：
SEITZ K

About SEITZ K

(Siemens, NC)

About Siemens, NC


Material：
Society of Plastics Engineers. Annual Technical Conference  (Society of Plastics Engineers. Technical Papers)

About Society of Plastics Engineers. Annual Technical Conference


Volume： 40th  Page： 780-782  Publication year： 1982 
JST Material Number： H0492A  Document type： Proceedings
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
epoxy resin

About epoxy resin

,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Other moldings 
(YH04090Q)

About Other moldings

Terms in the title (4)：
Terms in the title
Keywords automatically extracted from the title.
エポキシ樹脂

About エポキシ樹脂

, 
注型

About 注型

, 
金型

About 金型

, 
温度分布

About 温度分布


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