Art
J-GLOBAL ID：200902131006628884   Reference number：95A0601536

Elastic properties of filled epoxy encapsulants.

Author (2)：
FARQUHAR D S

About FARQUHAR D S

(IBM Microelectronics Div., New York)

About IBM Microelectronics Div., New York

, 
STEINWALL J E

About STEINWALL J E

(Motorola, Inc., Arizona)

About Motorola, Inc., Arizona


Material：
ASME. EEP (American Society of Mechanical Engineers. Electrical and Electronic Packaging Div.)  (ASME EEP (Am Soc Mech Eng Electr Electron Packag Div.))

About ASME. EEP (American Society of Mechanical Engineers. Electrical and Electronic Packaging Div.)


Volume： 10  Issue： Vol 2  Page： 707-711  Publication year： 1995 
JST Material Number： W0624A  Document type： Article
Country of issue： United States (USA)  Language： ENGLISH (EN)

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