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ArticleJ-GLOBAL ID:200902131023652438整理番号:94A0349666

ソルダ・リフロ法によるMCMへのTAB実装プロセス開発と評価

Development and evaluation of TAB assembly process by solder-reflow method for MCM.

著者:大島有美子(東芝 実装技セ)、平井浩之(東芝 実装技セ)、大野淳一(東芝 実装技セ)・・・
資料名:電子情報通信学会大会講演論文集 巻:1994 号:Shunki Pt 5 ページ:5.176
発行年:1994年03月
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