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ArticleJ-GLOBAL ID:200902131025755269整理番号:98A0769853

半導体実装基板用材料の動向

Recent Trends in Base Materials for Plastic Packaging Substrates.

著者:中村吉宏(日立化成工業)
資料名:日立化成テクニカルレポート 号:31 ページ:7-12
発行年:1998年07月
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J-GLOBAL: Linking, Expanding and Sparking

About J-GLOBAL

Linking

J-GLOBAL links information that represents the key to research and development. For example, linking articles and patents with people (authors and inventors) enables the extraction of a sequence of information.
It’s useful for making new discoveries and uncovering new information.

Expanding

The system enables searches of similar kinds of content through linkage with external sites.
It helps you to obtain knowledge from dissimilar fields and discover concepts that cross the boundaries of specialisms.

Sparking

Through repeated linkage and expansioniteration, J-GLOBAL provides unexpected hints for problem-solving and the illumination of new ideas.