Art
J-GLOBAL ID:200902131052132745   Reference number:94A0179983

Thermal stability of the Cu interconnect.

Cu配線の耐熱性
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Material:
Volume: 54th  Issue:Page: 768  Publication year: Sep. 1993 
JST Material Number: Y0055A  Document type: Proceedings
Country of issue: Japan (JPN)  Language: JAPANESE (JA)
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Terms in the title
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