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ArticleJ-GLOBAL ID:200902165026645400整理番号:02A0058350

Development of a new, more efficient and environmentally friendly method of producing high density interconnects. The "PRIME" process.

高密度接続基板を製造する新しい,より効率的で環境に優しい方法の開発 「PIME」プロセス

著者:ALBIN D(Coates Circuit Products, GBR)、RAMES J‐C(Matra BAe Dynamics, FRA)、DIETEL C(Bayerisches Laser Zentrum, DEU)・・・
資料名:Circuit World 巻:27 号:2 ページ:12-16
発行年:2001年
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