Art
J-GLOBAL ID：200902165098122924   Reference number：98A0981579

A concept to relate wire bonding parameters to bondability and ball bond reliability.

ワイヤボンディングパラメータを接合性およびボール接合信頼性に関係づけるための概念
Author (3)：
LIANG Z N

About LIANG Z N

(Philips Semiconductors, Nijmegen, NLD)

About Philips Semiconductors, Nijmegen, NLD

, 
KUPER F G

About KUPER F G

(Philips Semiconductors, Nijmegen, NLD)

About Philips Semiconductors, Nijmegen, NLD

, 
CHEN M S

About CHEN M S

(Philips Semiconductors, Kaohsiung, TWN)

About Philips Semiconductors, Kaohsiung, TWN


Material：
Microelectronics Reliability  (Microelectronics and Reliability)

About Microelectronics Reliability


Volume： 38  Issue： 6/8  Page： 1287-1291  Publication year： Jun. 1998 
JST Material Number： C0530A  ISSN： 0026-2714  Document type： Article
Article type： 原著論文  Country of issue： United Kingdom (GBR)  Language： ENGLISH (EN)
Thesaurus term：
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Keywords indexed to the article.
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*reliability(property)

About reliability(property)

,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Measurement,testing and reliability of solid-state devices 
(NC03040G)

About Measurement,testing and reliability of solid-state devices

Terms in the title (5)：
Terms in the title
Keywords automatically extracted from the title.
ワイヤボンディング

About ワイヤボンディング

, 
パラメータ

About パラメータ

, 
接合性

About 接合性

, 
ボール

About ボール

, 
概念

About 概念


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