Art
J-GLOBAL ID：200902165213796586   Reference number：01A0923819

Vibration analysis based modeling and defect recognition for flip chip solder joint inspection.

フリップチップはんだ接合検査のための振動解析によるモデリングと欠陥認識
Author (3)：
LIU S

About LIU S

(Georgia Inst. Technol., Georgia, USA)

About Georgia Inst. Technol., Georgia, USA

, 
ERDAHL D

About ERDAHL D

(Georgia Inst. Technol., Georgia, USA)

About Georgia Inst. Technol., Georgia, USA

, 
UME I C

About UME I C

(Georgia Inst. Technol., Georgia, USA)

About Georgia Inst. Technol., Georgia, USA


Material：
ASME. MED (American Society of Mechanical Engineers. Manufacturing Engineering Div.)  (ASME MED (Am Soc Mech Eng Manuf Eng Div))

About ASME. MED (American Society of Mechanical Engineers. Manufacturing Engineering Div.)


Volume： 11  Page： 405-412  Publication year： 2000 
JST Material Number： W0804A  Document type： Proceedings
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
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*flip chip method

About flip chip method

,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Materials of solid-state devices 
(NC03020K)

About Materials of solid-state devices

Terms in the title (6)：
Terms in the title
Keywords automatically extracted from the title.
フリップチップ

About フリップチップ

, 
はんだ接合

About はんだ接合

, 
検査

About 検査

, 
振動解析

About 振動解析

, 
モデリング

About モデリング

, 
欠陥

About 欠陥


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