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J-GLOBAL ID:200902165214320453   Reference number:01A0464912

Advanced Metrology for Rapid Characterization of the Thermal Mechanical Properties of Low-k Dielectric and Copper Thin Films.

低κ誘電体と銅薄膜の熱力学特性の迅速な特性化のための最新の計測方法
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Volume: 30  Issue:Page: 299-303  Publication year: Apr. 2001 
JST Material Number: D0277B  ISSN: 0361-5235  Document type: Article
Article type: 原著論文  Country of issue: United States (USA)  Language: ENGLISH (EN)
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Materials of solid-state devices 
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