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ArticleJ-GLOBAL ID:200902212425721711整理番号:09A0996405

Au先鋭バンプ/半田対向電極の溶融接合による低荷重チップ積層技術の開発

著者:QIU L.J.(九大 大学院)、渡辺直也(福岡県産業・科学技術振興財団)、浅野種正(九大 大学院)
資料名:応用物理学会学術講演会講演予稿集 巻:70th 号:2 ページ:794
発行年:2009年09月08日
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J-GLOBAL: Linking, Expanding and Sparking

About J-GLOBAL

Linking

J-GLOBAL links information that represents the key to research and development. For example, linking articles and patents with people (authors and inventors) enables the extraction of a sequence of information.
It’s useful for making new discoveries and uncovering new information.

Expanding

The system enables searches of similar kinds of content through linkage with external sites.
It helps you to obtain knowledge from dissimilar fields and discover concepts that cross the boundaries of specialisms.

Sparking

Through repeated linkage and expansioniteration, J-GLOBAL provides unexpected hints for problem-solving and the illumination of new ideas.