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ArticleJ-GLOBAL ID:200902212446448110整理番号:08A0383571

Enhanced thermal conductivity and viscosity of copper nanoparticles in ethylene glycol nanofluid

エチレングリコール・ナノ流体中の銅ナノ粒子の増強された熱伝導率及び粘性係数

著者:GARG J.(Dep. of Mechanical Engineering, Massachusetts Inst. of Technol., 77 Massachusetts Avenue, Cambridge, Massachusetts ...)、POUDEL B.(Dep. of Physics, Boston Coll., Chestnut Hill, Massachusetts 02467, USA)、CHIESA M.(Dep. of Mechanical Engineering, Massachusetts Inst. of Technol., 77 Massachusetts Avenue, Cambridge, Massachusetts ...)・・・
資料名:J Appl Phys 巻:103 号:7 ページ:074301
発行年:2008年04月01日
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J-GLOBAL: Linking, Expanding and Sparking

About J-GLOBAL

Linking

J-GLOBAL links information that represents the key to research and development. For example, linking articles and patents with people (authors and inventors) enables the extraction of a sequence of information.
It’s useful for making new discoveries and uncovering new information.

Expanding

The system enables searches of similar kinds of content through linkage with external sites.
It helps you to obtain knowledge from dissimilar fields and discover concepts that cross the boundaries of specialisms.

Sparking

Through repeated linkage and expansioniteration, J-GLOBAL provides unexpected hints for problem-solving and the illumination of new ideas.