Art
J-GLOBAL ID:200902212446448110   Reference number:08A0383571

Enhanced thermal conductivity and viscosity of copper nanoparticles in ethylene glycol nanofluid

エチレングリコール・ナノ流体中の銅ナノ粒子の増強された熱伝導率及び粘性係数
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Material:
Volume: 103  Issue:Page: 074301  Publication year: Apr. 01, 2008 
JST Material Number: C0266A  ISSN: 0021-8979  CODEN: JAPIAU  Document type: Article
Article type: 原著論文  Country of issue: United States (USA)  Language: ENGLISH (EN)
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Semi thesaurus term:
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
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Specific heat and thermal conduction in general  ,  Convective and radiative heat transfer 
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