About J-GLOBAL

日本語

Font size
  • A
  • A

Articleの詳細情報

ArticleJ-GLOBAL ID:200902212456699226整理番号:05A0924321

超高速LSIの高性能化のための材料技術の最前線―II 粒界拡散シミュレーションによるLSI用Cu配線の空孔成長解析

著者:大西隆(神戸製鋼所 材料研)、水野雅夫(神戸製鋼所 電技研)、古川哲也(神戸製鋼所)・・・
資料名:日本金属学会講演概要 巻:137th ページ:127
発行年:2005年09月28日
  • J-GLOBAL home
  • Bookmark J-GLOBAL

J-GLOBAL: Linking, Expanding and Sparking

About J-GLOBAL

Linking

J-GLOBAL links information that represents the key to research and development. For example, linking articles and patents with people (authors and inventors) enables the extraction of a sequence of information.
It’s useful for making new discoveries and uncovering new information.

Expanding

The system enables searches of similar kinds of content through linkage with external sites.
It helps you to obtain knowledge from dissimilar fields and discover concepts that cross the boundaries of specialisms.

Sparking

Through repeated linkage and expansioniteration, J-GLOBAL provides unexpected hints for problem-solving and the illumination of new ideas.