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J-GLOBAL ID:200902212464662501   Reference number:05A0514464

Selective silver seeding on laser modified polyimide for electroless copper plating

無電解銅めっきのためのレーザ改質ポリイミド上への選択銀シーディング
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Volume: 246  Issue: 1/3  Page: 167-173  Publication year: Jun. 15, 2005 
JST Material Number: B0707B  ISSN: 0169-4332  Document type: Article
Article type: 原著論文  Country of issue: Netherlands (NLD)  Language: ENGLISH (EN)
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Metallic thin films  ,  Laser irradiation effects and damages  ,  Manufacturing technology of solid-state devices 

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