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ArticleJ-GLOBAL ID:200902212469570052整理番号:08A0226458

Flexible and lithography-compatible copper foil substrates for ferroelectric thin films

強誘電体薄膜用可撓性でリソグラフィー適合性の銅箔基板

著者:LAUGHLIN B.(North Carolina State Univ., Dep. of Materials Sci. and Engineering, Raleigh, NC 27606, USA)、IHLEFELD J.f.(North Carolina State Univ., Dep. of Materials Sci. and Engineering, Raleigh, NC 27606, USA)、DANIELS Patrick(North Carolina State Univ., Dep. of Materials Sci. and Engineering, Raleigh, NC 27606, USA)・・・
資料名:Thin Solid Films 巻:516 号:10 ページ:3294-3297
発行年:2008年03月31日
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