Art

J-GLOBAL ID：200902212469570052   Reference number：08A0226458

Flexible and lithography-compatible copper foil substrates for ferroelectric thin films

強誘電体薄膜用可撓性でリソグラフィー適合性の銅箔基板

Author (4)： LAUGHLIN B. (North Carolina State Univ., Dep. of Materials Sci. and Engineering, Raleigh, NC 27606, USA) ,  IHLEFELD J.f. (North Carolina State Univ., Dep. of Materials Sci. and Engineering, Raleigh, NC 27606, USA) ,  DANIELS Patrick (North Carolina State Univ., Dep. of Materials Sci. and Engineering, Raleigh, NC 27606, USA) ,  MARIA J.-p. (North Carolina State Univ., Dep. of Materials Sci. and Engineering, Raleigh, NC 27606, USA)
Material： Thin Solid Films
Volume： 516  Issue： 10  Page： 3294-3297  Publication year： Mar. 31, 2008 
JST Material Number： B0899A  ISSN： 0040-6090  Document type： Article
Article type： 原著論文  Country of issue： Netherlands (NLD)  Language： ENGLISH (EN)

Thesaurus term： *ferroelectrics ,  *lithography ,  *copper foil ,  *substrate(plate) ,  roughness ,  mean value ,  titanate ,  barium compound ,  coefficient ,  microwave circuit ,  circuit component ,  pattern formation ,  *dielectric thin film ,  *property
Semi thesaurus term： patterning ,  circuit element ,  loss coefficient ,  *compatibility

JST classification (1)： Manufacturing technology of solid-state devices  (NC03030V)

Terms in the title (5)： 強誘電体薄膜 ,  可撓性 ,  リソグラフィー ,  適合性 ,  銅箔