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ArticleJ-GLOBAL ID:200902212471972079整理番号:05A0997756

3ω法による先端半導体デバイス薄膜材料の熱伝導率測定

Measurement of Thermal Conductivity for Thin-films of Advanced Semiconductor Devices by 3.OMEGA. Method

著者:遠藤亮(東レリサーチセ)、山根常幸(東レリサーチセ)、桑原正史(産業技術総合研)
資料名:Thermophys Prop 巻:26th ページ:209-211
発行年:2005年11月09日
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J-GLOBAL: Linking, Expanding and Sparking

About J-GLOBAL

Linking

J-GLOBAL links information that represents the key to research and development. For example, linking articles and patents with people (authors and inventors) enables the extraction of a sequence of information.
It’s useful for making new discoveries and uncovering new information.

Expanding

The system enables searches of similar kinds of content through linkage with external sites.
It helps you to obtain knowledge from dissimilar fields and discover concepts that cross the boundaries of specialisms.

Sparking

Through repeated linkage and expansioniteration, J-GLOBAL provides unexpected hints for problem-solving and the illumination of new ideas.