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ArticleJ-GLOBAL ID:200902212497919478整理番号:09A0167033

CSP用アンダーフィル材のはんだバンプ繰り返し熱疲労寿命への影響

著者:梨子田典弘(富士電機デバイステクノロジー)、武井信二(富士電機デバイステクノロジー 電子デバイス研)、吉田泰樹(富士電機デバイステクノロジー)・・・
資料名:Symp Microjoining Assem Technol Electron 巻:15th ページ:171-174
発行年:2009年01月29日
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J-GLOBAL: Linking, Expanding and Sparking

About J-GLOBAL

Linking

J-GLOBAL links information that represents the key to research and development. For example, linking articles and patents with people (authors and inventors) enables the extraction of a sequence of information.
It’s useful for making new discoveries and uncovering new information.

Expanding

The system enables searches of similar kinds of content through linkage with external sites.
It helps you to obtain knowledge from dissimilar fields and discover concepts that cross the boundaries of specialisms.

Sparking

Through repeated linkage and expansioniteration, J-GLOBAL provides unexpected hints for problem-solving and the illumination of new ideas.