About J-GLOBAL

日本語

Font size
  • A
  • A

Articleの詳細情報

ArticleJ-GLOBAL ID:200902212511755890整理番号:04A0189627

Effect of Stress Control Layer (SCL) on Via-stability in Organic Low-k/Cu Dual damascene Interconnects under Thermal Cycle Stress

熱サイクルストレス下における有機low‐κ/Cuデュアルダマシン配線のビア安定性への応力制御層(SCL)の効果

著者:TAGAMI M(NEC Corp.)、OHTAKE H(NEC Corp.)、HAYASHI Y(NEC Corp.)・・・
資料名:Proc IEEE 2003 Int Interconnect Technol Conf ページ:213-215
発行年:2003年
  • J-GLOBAL home
  • Bookmark J-GLOBAL

J-GLOBAL: Linking, Expanding and Sparking

About J-GLOBAL

Linking

J-GLOBAL links information that represents the key to research and development. For example, linking articles and patents with people (authors and inventors) enables the extraction of a sequence of information.
It’s useful for making new discoveries and uncovering new information.

Expanding

The system enables searches of similar kinds of content through linkage with external sites.
It helps you to obtain knowledge from dissimilar fields and discover concepts that cross the boundaries of specialisms.

Sparking

Through repeated linkage and expansioniteration, J-GLOBAL provides unexpected hints for problem-solving and the illumination of new ideas.