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ArticleJ-GLOBAL ID:200902212515365280整理番号:07A0960559

プリント配線板/パッケージ基板の最新技術動向 回路基板・配線板編 次世代型基板内蔵キャパシタ材料

著者:山崎一浩(オーク三井テクノロジーズ)、府川佳広(TechDream, Inc.)
資料名:電子材料 巻:46 号:10 ページ:52-58
発行年:2007年10月01日
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J-GLOBAL: Linking, Expanding and Sparking

About J-GLOBAL

Linking

J-GLOBAL links information that represents the key to research and development. For example, linking articles and patents with people (authors and inventors) enables the extraction of a sequence of information.
It’s useful for making new discoveries and uncovering new information.

Expanding

The system enables searches of similar kinds of content through linkage with external sites.
It helps you to obtain knowledge from dissimilar fields and discover concepts that cross the boundaries of specialisms.

Sparking

Through repeated linkage and expansioniteration, J-GLOBAL provides unexpected hints for problem-solving and the illumination of new ideas.