Research field (1):
Electric/electronic material engineering
Research keywords (3):
Evaluation of RF system in a packaging
, Evaluation of semiconductor packaging
, Diamond-like carbon thin film materials
Papers (58):
Tadashi Suetsugu. Evaluation of fine patterned silicon trough silicon via using sacnning laser beam induced current. 第28回マイクロエレクトロニクスシンポジウム論文集. 2018. 289-292
Woon Choi, Tadashi Suetsugu. Failure Evaluation of Silicon Through-Silicon-Via for Three-Dimensional Integration. MES2017. 2017. 27. 307-310
Takashi Ogawa, Yonggun Han, Woon Choi, Takayuki Suzuki. High Frequency Transmission Property of Fine Pattern CPW Lines Fabricated Using SAP and Damascene Process. MES2017. 2017. 27. 339-342
Evaluation of fine patterned silicon through silicon via using scanning laser beam induced current
(MES2018 2018)
SLBIC法を用いたブラインドシリコンTSV評価
(応用物理学会九州支部講演会 2017)
微細CPWの高周波伝送特性評価
(応用物理学会九州支部講演会 2017)
High frequency transmission properties of ultra-fine line CPW fabricated High frequency transmission properties of ultra-fine line CPW fabricated using SAP and damascene process
(Joint Symposium on Electronic Materials 2017)
Failure Evaluation of Silicon Through-Silicon-via for Three-Dimensional Integration
(MES2017 2017)