Rchr
J-GLOBAL ID:200901090313263883   Update date: Feb. 14, 2024

Choi Woon

チエ ウン | Choi Woon
Affiliation and department:
Research field  (1): Electric/electronic material engineering
Research keywords  (3): Evaluation of RF system in a packaging ,  Evaluation of semiconductor packaging ,  Diamond-like carbon thin film materials
Papers (58):
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Lectures and oral presentations  (76):
  • Evaluation of fine patterned silicon through silicon via using scanning laser beam induced current
    (MES2018 2018)
  • SLBIC法を用いたブラインドシリコンTSV評価
    (応用物理学会九州支部講演会 2017)
  • 微細CPWの高周波伝送特性評価
    (応用物理学会九州支部講演会 2017)
  • High frequency transmission properties of ultra-fine line CPW fabricated High frequency transmission properties of ultra-fine line CPW fabricated using SAP and damascene process
    (Joint Symposium on Electronic Materials 2017)
  • Failure Evaluation of Silicon Through-Silicon-via for Three-Dimensional Integration
    (MES2017 2017)
more...
Professional career (2):
  • 工学博士 (ホンイク大学校)
  • PH.D. (Hongik University)
Work history (6):
  • 1999/07/01 - 2007/03/31 Fukuoka University,Foreign Researcher
  • 1999/06/07 - 2007/03/31 Fukuoka Industry, Science and Technology Foundation, Researcher
  • 1996/09/01 - 1999/06/05 Hongik University, Postdoctoral
  • 1998/09/01 - 1999/02/28 Kookmin University, Instructor
  • 1993/03/02 - 1994/08/31 Taejon National Technical University, Instructor
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Awards (1):
  • 2016/04/20 - The Japan Institute of Electronics Packaging (JIEP) Outstanding Technical Paper Award
Association Membership(s) (1):
Japan Institute of Electronics Packaging
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