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ArticleJ-GLOBAL ID:200902076490164870整理番号:91A0390552

超音波スペクトロスコピーによるプリント基板のソルダーレジストの膜厚測定

Thickness measurements of solder resist layer in printed wiring boards by ultrasonic micro-spectrometer.

著者:大平克己(凸版印刷 総研)、斎藤雅雄(凸版印刷 総研)
資料名:日本音響学会研究発表会講演論文集 巻:1991 号:Spring Pt 2 ページ:691-692
発行年:1991年03月
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J-GLOBAL: Linking, Expanding and Sparking

About J-GLOBAL

Linking

J-GLOBAL links information that represents the key to research and development. For example, linking articles and patents with people (authors and inventors) enables the extraction of a sequence of information.
It’s useful for making new discoveries and uncovering new information.

Expanding

The system enables searches of similar kinds of content through linkage with external sites.
It helps you to obtain knowledge from dissimilar fields and discover concepts that cross the boundaries of specialisms.

Sparking

Through repeated linkage and expansioniteration, J-GLOBAL provides unexpected hints for problem-solving and the illumination of new ideas.