Art
J-GLOBAL ID：200902076556710242   Reference number：93A0471566

An interconnect technology for high density multichip systems.

高密度マルチチップシステムの配線接続技術
Author (3)：
JAAFAR M A S

About JAAFAR M A S

(Univ. Wisconsin-Madison, WI)

About Univ. Wisconsin-Madison, WI

, 
BAJIKAR S

About BAJIKAR S

(Univ. Wisconsin-Madison, WI)

About Univ. Wisconsin-Madison, WI

, 
DENTON D D

About DENTON D D

(Univ. Wisconsin-Madison, WI)

About Univ. Wisconsin-Madison, WI


Material：
Proceedings of the IEEE Midwest Symposium on Circuits and Systems  (MWSCAS)

About Proceedings of the IEEE Midwest Symposium on Circuits and Systems


Volume： 35th  Issue： Vol 2  Page： 1249-1251  Publication year： 1992 
JST Material Number： D0551A  ISSN： 1548-3746  Document type： Proceedings
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
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Keywords indexed to the article.
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multichip packaging

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,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Manufacturing technology of solid-state devices 
(NC03030V)

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