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ArticleJ-GLOBAL ID:200902076650681434整理番号:88A0137977

チタンシリサイド化接合の耐熱性

Thermal stability of titanium silicide junctions.

著者:吉田岳人(松下電器産業 半導体研セ)、小川真一(松下電器産業 半導体研セ)、奥田誠司(松下電器産業 半導体研セ)・・・
資料名:電子情報通信学会技術研究報告 巻:87 号:243 ページ:73-77(SDM87-136)
発行年:1987年11月13日
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