Art

J-GLOBAL ID：201702257581238488   Reference number：17A0229899

Fabrication and Properties of Thermally Conductive Epoxy Resin Nanocomposites Filled with fGNPs/PNBRs Hybrid Fillers

fGNP/PNBRハイブリッド充填剤を充填した熱伝導性エポキシ樹脂ナノ複合材料の作製と性質

Author (5)： GU Junwei (Northwestern Polytechnical Univ., Shaan Xi, CHN) ,  LV Zhaoyuan (Northwestern Polytechnical Univ., Shaan Xi, CHN) ,  YANG Xutong (Northwestern Polytechnical Univ., Shaan Xi, CHN) ,  WANG Gai'e (Northwestern Polytechnical Univ., Shaan Xi, CHN) ,  ZHANG Qiuyu (Northwestern Polytechnical Univ., Shaan Xi, CHN)
Material： Science of Advanced Materials  (Sci Adv Mater)
Volume： 8  Issue： 5  Page： 972-979  Publication year： May. 2016 
JST Material Number： W2374A  ISSN： 1947-2935  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)

Thesaurus term： *filler(admixture) ,  *nanocomposites ,  *epoxy resin ,  mold and pattern ,  nanostructure ,  nitrile rubber ,  butadiene rubber ,  thermal stability ,  functional material ,  integrated circuit ,  heat removal ,  hybrid composite material ,  heat transfer coefficient ,  functionalization ,  silane coupling agent ,  compatibility(blend) ,  electrical conductivity ,  mechanical property ,  impact strength ,  bending strength ,  graphite ,  graphene ,  phenolic compound ,  aliphatic compound ,  sulfonic acid
Semi thesaurus term： *nanofiller ,  *conductive filler ,  hybrid type ,  nanoplatelet ,  heat interface material ,  heat conduction coefficient ,  silane coupling agent ,  mechanical property ,  impact strength ,  bending strength

JST classification (4)： Fillers,reinforcement  (YH05030J) ,  Epoxy resins  (YH07040I) ,  Materials of solid-state devices  (NC03020K) ,  Carbon and its compounds  (YB02060D)

Substance index (3)： Bisphenol A ,  Methanesulfonic acid ,  3-(Glycidyloxy)propyltrimethoxysilane

Terms in the title (6)： 充填剤 ,  熱伝導性 ,  エポキシ樹脂 ,  ナノ複合材料 ,  作製 ,  性質