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J-GLOBAL ID：201602016460798168   Reference number：70A0243556

Multilayer interconnection technology.

多層配線技術
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Author (3)：
HEINECKE R

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, 
ELDRIDGE P G

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, 
PION M

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Material：
IEE Conf Publ (Inst Electr Eng)  (IEE Conference Report Series)

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Issue： 54  Page： 27-28  Publication year： 1969 
JST Material Number： B0665A  ISSN： 0537-9989  Document type： Proceedings
Article type： 予稿  Country of issue： United Kingdom (GBR)  Language： ENGLISH (EN)
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集積回路

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, 
真空蒸着

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Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
Si3N4

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多層配線

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