Art

J-GLOBAL ID：201702293426605692   Reference number：17A0062423

Recycling of Waste Printed Circuit Board and Preparation of High Strength High Purity Copper Foil by Electrochemical Method

電気化学的方法による廃プリント基板の高純度銅箔の回収【JST・京大機械翻訳】

Author (4)： Deng Shuhao (School of Materials Science and Engineering,Central South University, The Key Laboratory of Nonferrous Metal of Ministry of Education) ,  Zhang Duoduo (School of Materials Science and Engineering,Central South University, The Key Laboratory of Nonferrous Metal of Ministry of Education) ,  Zhou Jinxiang (School of Materials Science and Engineering,Central South University) ,  Liu Huiqun (School of Materials Science and Engineering,Central South University, The Key Laboratory of Nonferrous Metal of Ministry of Education)
Material： Xiyou Jinshu  (Chinese Journal of Rare Metals)
Volume： 40  Issue： 9  Page： 914-921  Publication year： 2016 
JST Material Number： C2058A  ISSN： 0258-7076  Document type： Article
Article type： 原著論文  Country of issue： China (CHN)  Language： CHINESE (ZH)

Abstract/Point： High strength high purity Cu f...

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Thesaurus term： electrical resistivity ,  corrosion resistance ,  optimum condition ,  characterization ,  *copper foil ,  acidity(property) ,  scanning electron microscope ,  recovery rate ,  current density ,  preferred orientation ,  copper sulfate ,  X-ray diffraction ,  *electrochemistry ,  *copper ,  *purity

Author keywords (6)： waste printed circuit board ,  recycle ,  electrodeposition ,  high purity ,  high strength ,  copper foil

JST classification (9)： Chemical treatment of sewage and wastewater  (SC03050W) ,  Recycling of resources  (SC05060V) ,  Smelting  (WD02030A) ,  Secondary batteries  (YB04030K) ,  Thin films of other inorganic compounds  (BK14060A) ,  Semiconductor thin films  (BK14040E) ,  Corrosion prevention  (WB03040M) ,  Substance production by microorganisms,cultured tissues/cells in general  (FK03010P) ,  Wastewater treatment  (FJ02022Y)

Terms in the title (4)： 電気化学 ,  廃プリント基板 ,  高純度 ,  銅箔