Art

J-GLOBAL ID：201702298891235609   Reference number：17A0532312

Thermal cycle effects on microstructures and mechanical properties of copper-clad aluminium bus bars

銅被覆の微細構造と機械的性質に及ぼす熱サイクルの影響を研究した。【JST・京大機械翻訳】

Author (6)： Wang Bing (School of Materials Science and Engineering, University of Shanghai for Science and Technology) ,  Liu Ping (School of Materials Science and Engineering, University of Shanghai for Science and Technology) ,  Liu Xinkuan (School of Materials Science and Engineering, University of Shanghai for Science and Technology) ,  Wang Ziyan (ASL Automobiles Science & Technology (Shanghai) Co., Ltd) ,  Chen Xiaohong (School of Materials Science and Engineering, University of Shanghai for Science and Technology) ,  Liu Xiaozhi (ASL Automobiles Science & Technology (Shanghai) Co., Ltd)
Material： Gongneng Cailiao  (Journal of Functional Materials)
Volume： 47  Issue： 12  Page： 12104-12109  Publication year： 2016 
JST Material Number： C2095A  ISSN： 1001-9731  CODEN： GOCAEA  Document type： Article
Article type： 原著論文  Country of issue： China (CHN)  Language： CHINESE (ZH)

Abstract/Point： The thermal cycle tests were c...

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Thesaurus term： bond strength ,  *heat cycle ,  polarizing microscope ,  covering ,  electron microscopy ,  micro structure ,  interface(surface) ,  X-ray diffraction ,  mechanical property ,  scanning electron microscope ,  *copper
Semi thesaurus term： 熱サイクル試験 , 【Automatic Indexing@JST】

Author keywords (6)： copper-clad aluminium bus bars ,  thermal cycle ,  bonding layer ,  bond strength ,  microstructure ,  intermediate compound

JST classification (6)： Properties of ceramics and ceramic whiteware  (YC03030G) ,  Mechanical properties of solids in general  (BL01021C) ,  Ceramic coating to nonmetallic materials  (YC02040K) ,  Bases,metal oxides  (CD01030Z) ,  Oxide thin films  (BK14050P) ,  Thin films of other inorganic compounds  (BK14060A)

Terms in the title (5)： 銅 ,  微細構造 ,  機械的性質 ,  熱サイクル ,  研究