文献
J-GLOBAL ID:200902285248055541
整理番号:09A0389832
単軸応力下の電気めっき銅薄膜の疲れ強さ
Fatigue Strength of Electroplated Copper Thin Films under Uni-Axial Stress
著者 (4件):
MURATA Naokazu
(Fracture and Reliability Res. Inst., Graduate School of Engineering, Tohoku Univ.)
,
TAMAKAWA Kinji
(Fracture and Reliability Res. Inst., Graduate School of Engineering, Tohoku Univ.)
,
SUZUKI Ken
(Fracture and Reliability Res. Inst., Graduate School of Engineering, Tohoku Univ.)
,
MIURA Hideo
(Fracture and Reliability Res. Inst., Graduate School of Engineering, Tohoku Univ.)
資料名:
Journal of Solid Mechanics and Materials Engineering (Web)
(Journal of Solid Mechanics and Materials Engineering (Web))
巻:
3
号:
3
ページ:
498-506 (J-STAGE)
発行年:
2009年
JST資料番号:
U0026A
ISSN:
1880-9871
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
日本 (JPN)
言語:
英語 (EN)